View LT5527_194833.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

LT5527 400MHz to 3.7GHz High Signal Level Downconverting Mixer
FEATURES

DESCRIPTIO
50 Single-Ended RF and LO Ports Wide RF Frequency Range: 400MHz to 3.7GHz* High Input IP3: 24.5dBm at 900MHz 23.5dBm at 1900MHz Conversion Gain: 3.2dB at 900MHz 2.3dB at 1900MHz Integrated LO Buffer: Low LO Drive Level High LO-RF and LO-IF Isolation Low Noise Figure: 11.6dB at 900MHz 12.5dB at 1900MHz Very Few External Components Enable Function 4.5V to 5.25V Supply Voltage Range 16-Lead (4mm x 4mm) QFN Package
The LT(R)5527 active mixer is optimized for high linearity, wide dynamic range downconverter applications. The IC includes a high speed differential LO buffer amplifier driving a double-balanced mixer. Broadband, integrated transformers on the RF and LO inputs provide singleended 50 interfaces. The differential IF output allows convenient interfacing to differential IF filters and amplifiers, or is easily matched to drive 50 single-ended, with or without an external transformer. The RF input is internally matched to 50 from 1.7GHz to 3GHz, and the LO input is internally matched to 50 from 1.2GHz to 5GHz. The frequency range of both ports is easily extended with simple external matching. The IF output is partially matched and usable for IF frequencies up to 600MHz. The LT5527's high level of integration minimizes the total solution cost, board space and system-level variation.
, LTC and LT are registered trademarks of Linear Technology Corporation. All other trademarks are the property of their respective owners. *Operation over a wider frequency range is possible with reduced performance. Consult factory for information and assistance.
APPLICATIO S

Cellular, WCDMA, TD-SCDMA and UMTS Infrastructure GSM900/GSM1800/GSM1900 Infrastructure 900MHz/2.4GHz/3.5GHz WLAN MMDS, WiMAX High Linearity Downmixer Applications
TYPICAL APPLICATIO
LO INPUT -3dBm (TYP) LT5527
High Signal Level Downmixer for Multi-Carrier Wireless Infrastructure
1.9GHz Conversion Gain, IIP3, SSB NF and LO-RF Leakage vs LO Power
24 22 IIP3 20 18 16 14 12 SSB NF 10 8 6 4G C 2 -9 LO-RF -20 -25 -30 IF = 240MHz LOW SIDE LO -35 TA = 25C -40 VCC = 5V -45 -50 -55 -60 -65 -70 -75 -7 -5 -3 -1 LO POWER (dBm) 1 3
5527 TA01b
GC, SSB NF (dB), IIP3 (dBm)
4.7pF IF+ 100nH 1nF 220nH RF INPUT RF BIAS GND EN VCC2 VCC1 1nF IF
-
4.7pF
IF OUTPUT 240MHz
100nH 5V 1F
5527 TA01a
U
LO-RF LEAKAGE (dBm)
5527f
U
U
1
LT5527
ABSOLUTE
(Note 1)
AXI U
RATI GS
PACKAGE/ORDER I FOR ATIO
TOP VIEW
NC NC
Supply Voltage (VCC1, VCC2, IF+, IF-) ...................... 5.5V Enable Voltage ............................... -0.3V to VCC + 0.3V LO Input Power (380MHz to 4GHz) .................. +10dBm LO Input DC Voltage ............................ -1V to VCC + 1V RF Input Power (400MHz to 4GHz) .................. +12dBm RF Input DC Voltage ............................................ 0.1V Operating Temperature Range ............... - 40C to 85C Storage Temperature Range ................ - 65C to 125C Junction Temperature (TJ)................................... 125C
16 15 14 13 NC 1 NC 2 RF 3 NC 4 5
EN
ORDER PART NUMBER
12 GND 11 IF+ 10 IF- 9 GND
NC
LO
LT5527EUF
17
6
VCC2
7
VCC1
8
NC
UF PART MARKING 5527
UF PACKAGE 16-LEAD (4mm x 4mm) PLASTIC QFN
TJMAX = 125C, JA = 37C/W EXPOSED PAD (PIN 17) IS GND MUST BE SOLDERED TO PCB
Consult LTC Marketing for parts specified with wider operating temperature ranges.
DC ELECTRICAL CHARACTERISTICS
VCC = 5V, EN = High, TA = 25C, unless otherwise specified. Test circuit shown in Figure 1. (Note 3)
PARAMETER Power Supply Requirements (VCC) Supply Voltage Supply Current VCC1 (Pin 7) VCC2 (Pin 6) IF+ + IF- (Pin 11 + Pin 10) Total Supply Current EN = Low 3 0.3 EN = 5V DC 50 3 3 90 4.5 5 23.2 2.8 52 78 5.25 V DC mA mA mA mA A V DC V DC A s s CONDITIONS MIN TYP MAX UNITS
60 88 100
Enable (EN) Low = Off, High = On Shutdown Current Input High Voltage (On) Input Low Voltage (Off) EN Pin Input Current Turn-ON Time Turn-OFF Time
AC ELECTRICAL CHARACTERISTICS
PARAMETER RF Input Frequency Range LO Input Frequency Range IF Output Frequency Range RF Input Return Loss LO Input Return Loss IF Output Impedance LO Input Power CONDITIONS
Test circuit shown in Figure 1. (Notes 2, 3)
MIN 400 1200 to 3500 380 0.1 to 600 >10 >12 407||2.5pF -8 -5 -3 0 2 5 TYP 1700 to 3000 3700 MAX UNITS MHz MHz MHz MHz MHz dB dB R||C dBm dBm
5527f
No External Matching (Midband) With External Matching (Low Band or High Band) No External Matching With External Matching Requires Appropriate IF Matching ZO = 50, 1700MHz to 3000MHz ZO = 50, 1200MHz to 3400MHz Differential at 240MHz 1200MHz to 3500MHz 380MHz to 1200MHz
2
U
W
U
U
WW
W
LT5527
AC ELECTRICAL CHARACTERISTICS
PARAMETER Conversion Gain CONDITIONS
Standard Downmixer Application: VCC = 5V, EN = High, TA = 25C, PRF = - 5dBm (-5dBm/tone for 2-tone IIP3 tests, f = 1MHz), fLO = fRF - fIF, PLO = -3dBm (0dBm for 450MHz and 900MHz tests), IF output measured at 240MHz, unless otherwise noted. Test circuit shown in Figure 1. (Notes 2, 3, 4)
MIN TYP 2.5 3.4 2.3 2.3 2.0 1.8 0.3 -0.018 23.2 24.5 24.2 23.5 22.7 20.8 18.2 13.3 11.6 12.1 12.5 13.2 13.9 16.1 -44 -36 -40 -50 >43 >38 >42 >54 -60 -65 -73 -63 9.5 8.9 9.0 MAX UNITS dB dB dB dB dB dB dB dB/C dBm dBm dBm dBm dBm dBm dBm dB dB dB dB dB dB dB dBm dBm dBm dBm dB dB dB dB dBc dBc dBc dBc dBm dBm dBm RF = 450MHz, IF = 140MHz, High Side LO RF = 900MHz, IF = 140MHz RF = 1700MHz RF = 1900MHz RF = 2200MHz RF = 2650MHz RF = 3500MHz, IF = 380MHz TA = - 40C to 85C, RF = 1900MHz RF = 450MHz, IF = 140MHz, High Side LO RF = 900MHz, IF = 140MHz RF = 1700MHz RF = 1900MHz RF = 2200MHz RF = 2650MHz RF = 3500MHz, IF = 380MHz RF = 450MHz, IF = 140MHz, High Side LO RF = 900MHz, IF = 140MHz RF = 1700MHz RF = 1900MHz RF = 2200MHz RF = 2650MHz RF = 3500MHz, IF = 380MHz fLO = 400MHz to 2100MHz fLO = 2100MHz to 3200MHz fLO = 400MHz to 700MHz fLO = 700MHz to 3200MHz fRF = 400MHz to 2200MHz fRF = 2200MHz to 3700MHz fRF = 400MHz to 800MHz fRF = 800MHz to 3700MHz 900MHz: fRF = 830MHz at -5dBm, fIF = 140MHz 1900MHz: fRF = 1780MHz at -5dBm, fIF = 240MHz 900MHz: fRF = 806.67MHz at -5dBm, fIF = 140MHz 1900MHz: fRF = 1740MHz at -5dBm, fIF = 240MHz RF = 450MHz, IF = 140MHz, High Side LO RF = 900MHz, IF = 140MHz RF = 1900MHz
Conversion Gain vs Temperature Input 3rd Order Intercept
Single-Sideband Noise Figure
LO to RF Leakage LO to IF Leakage RF to LO Isolation RF to IF Isolation 2RF-2LO Output Spurious Product (fRF = fLO + fIF/2) 3RF-3LO Output Spurious Product (fRF = fLO + fIF/3) Input 1dB Compression
Note 1: Absolute Maximum Ratings are those values beyond which the life of a device may be impaired. Note 2: 450MHz, 900MHz and 3500MHz performance measured with external LO and RF matching. See Figure 1 and Applications Information. Note 3: Specifications over the -40C to 85C temperature range are assured by design, characterization and correlation with statistical process controls.
Note 4: SSB Noise Figure measurements performed with a small-signal noise source and bandpass filter on RF input, and no other RF signal applied.
5527f
3
LT5527
Midband (No external RF/LO matching) VCC = 5V, EN = High, PRF = -5dBm (-5dBm/tone for 2-tone IIP3 tests, f = 1MHz), PLO = -3dBm, IF output measured at 240MHz, unless otherwise noted. Test circuit shown in Figure 1. Conversion Gain, IIP3 and NF vs RF Frequency
24 22 GC, SSB NF (dB), IIP3 (dBm) 20 18
LO LEAKAGE (dBm)
TYPICAL AC PERFOR A CE CHARACTERISTICS
IIP3
ISOLATION (dB)
16 14 12 10 8 6 4 2
SSB NF
TA = 25C IF = 240MHz LOW SIDE LO HIGH SIDE LO GC 1900 2300 2500 2100 RF FREQUENCY (MHz) 2700
5527 G01
0 1700
Conversion Gain and IIP3 vs Temperature (Low Side LO)
25 24 23 22
IIP3 (dBm)
IIP3
GC, SSB NF (dB), IIP3 (dBm)
21 20 19 18 17 16 15 -50 -25 25 50 0 TEMPERATURE (C) 75 GC IF = 240MHz 1700MHz 1900MHz 2200MHz
6 5 4 3 2 1
IIP3 (dBm)
5527 G04
1700MHz Conversion Gain, IIP3 and NF vs LO Power
25 23 GC, SSB NF (dB), IIP3 (dBm) 21 19 17 15 13 11 9 7 5 3 1 GC -9 -7 -5 -3 -1 LO INPUT POWER (dBm) 1 3
5527 G07
IIP3
GC, SSB NF (dB), IIP3 (dBm)
GC, SSB NF (dB), IIP3 (dBm)
SSB NF
LOW SIDE LO IF = 240MHz -40C 25C 85C
4
UW
10 9 8 7
GC (dB)
LO Leakage vs LO Frequency
-30 -35 -40 -45 -50 -55 -60 -65 -70 -75 -80 -85 -90 1200 1500 1800 2100 2400 2700 LO FREQUENCY (MHz) 3000 LO-IF LO-RF TA = 25C PLO = -3dBm
-30 -35 -40 -45 -50 -55 -60 -65 -70 -75 -80 -85
RF Isolation vs RF Frequency
TA = 25C
RF-LO
RF-IF
-90 1700
1900
2300 2500 2100 RF FREQUENCY (MHz)
2700
5527 G03
5527 G02
Conversion Gain and IIP3 vs Temperature (High Side LO)
25 24 23 22 21 20 19 18 17 16 15 -50 -25 25 50 0 TEMPERATURE (C) 75 GC IF = 240MHz 1700MHz 1900MHz 2200MHz IIP3 10 9 8 7 6 5 4 3 2 1
GC (dB)
24 22 20 18 16 14 12 10 8 6 4 2
1900MHz Conversion Gain, IIP3 and NF vs Supply Voltage
IIP3
LOW SIDE LO IF = 240MHz -40C 25C 85C
SSB NF
GC
0 100
0 100
5527 G05
0 4.5
5 4.75 5.25 SUPPLY VOLTAGE (V)
5.5
5527 G06
1900MHz Conversion Gain, IIP3 and NF vs LO Power
24 22 20 18 16 14 12 10 8 6 4 2 0 -9 -7 -5 -3 -1 LO INPUT POWER (dBm) 1 3
5527 G08
2200MHz Conversion Gain, IIP3 and NF vs LO Power
24 22 20 IIP3 18 16 14 12 10 8 6 4 GC 2 0 -9 -7 -5 -3 -1 LO INPUT POWER (dBm) 1 3
5527 G09
IIP3
SSB NF
LOW SIDE LO IF = 240MHz -40C 25C 85C
SSB NF LOW SIDE LO IF = 240MHz -40C 25C 85C
GC
5527f
LT5527
Midband (No external RF/LO matching) VCC = 5V, EN = High, PRF = -5dBm (-5dBm/tone for 2-tone IIP3 tests, f = 1MHz), PLO = -3dBm, IF output measured at 240MHz, unless otherwise noted. Test circuit shown in Figure 1. IF Output Power, IM3 and IM5 vs RF Input Power (2 Input Tones)
10 0
OUTPUT POWER/TONE (dBm)
15
TYPICAL AC PERFOR A CE CHARACTERISTICS
IFOUT, 2 x 2 and 3 x 3 Spurs vs RF Input Power (Single Tone)
TA = 25C 5 LO = 1660MHz -5 IF = 240MHz OUTPUT POWER (dBm) -15 -25 -35 -45 -55 -65 -75 -85 -95 -18 -15 -12 -9 -6 -3 0 3 6 RF INPUT POWER (dBm) 9 3RF-3LO (RF = 1740MHz)
-20 -30 -40 -50 -60 -70 -80 -90 IM3 IM5 0 -6 -3 -18 -15 -12 -9 RF INPUT POWER (dBm/TONE) 5527 G10 TA = 25C RF1 = 1899.5MHz RF2 = 1900.5MHz LO = 1660MHz
RELATIVE SPUR LEVEL (dBc)
-10
IFOUT
-100 -21
High Band (3500MHz application with external RF matching) VCC = 5V, EN = High, PRF = -5dBm (-5dBm/tone for 2-tone IIP3 tests, f = 1MHz), low side LO, PLO = -3dBm, IF output measured at 380MHz, unless otherwise noted. Test circuit shown in Figure 1. Conversion Gain, IIP3 and SSB NF vs RF Frequency
20 18 GC, SSB NF (dB), IIP3 (dBm) 16 14 12 10 8 6 4 2 GC 3500 3400 3600 RF FREQUENCY (MHz) 3700
5527 G13
IIP3 SSB NF LOW SIDE LO IF = 380MHz TA = 25C GC, SSB NF (dB), IIP3 (dBm)
13 11 9 7 5 3 1 -1 -9 -7 -3 -1 -5 LO INPUT POWER (dBm) 1 3
5527 G14
LO LEAKAGE (dBm)
0 3300
Low Band (450MHz application with external RF/LO matching) VCC = 5V, EN = High, PRF = -5dBm (-5dBm/tone for 2-tone IIP3 tests, f = 1MHz), PLO = 0dBm, IF output measured at 140MHz, unless otherwise noted. Test circuit shown in Figure 1. Conversion Gain, IIP3 and NF vs RF Frequency
24 22
GC, SSB NF (dB), IIP3 (dBm)
20 18 16 14 12 10 8 6 4 2
IIP3
GC, SSB NF (dB), IIP3 (dBm)
SSB NF
16 14 12 10 8 6 4 2 0
LO LEAKAGE (dBm)
HIGH SIDE LO TA = 25C IF = 140MHz
GC 0 400
450 425 475 RF FREQUENCY (MHz)
5527 G18
UW
500
2 x 2 and 3 x 3 Spurs vs LO Power (Single Tone)
-50 -55 3RF-3LO (RF = 1740MHz)
IFOUT (RF = 1900MHz)
-60 -65 -70 -75 -80 -85 -90 -95 TA = 25C LO = 1660MHz IF = 240MHz PRF = -5dBm -9 -7
2RF-2LO (RF = 1780MHz)
2RF-2LO (RF = 1780MHz)
-100
12
5527 G11
-3 -1 -5 LO INPUT POWER (dBm)
1
3
5527 G12
3500MHz Conversion Gain, IIP3 and SSB NF vs LO Power
19 17 15 IIP3 SSB NF
-30 -20
LO Leakage and RF-LO Isolation vs LO and RF Frequency
60
50 RF-LO ISOLATION (dB) LO-RF
LOW SIDE LO IF = 380MHz TA = 25C
-40
RF-LO
40
-50
30
-60
GC
LO-IF
20
-70 3000
3400 3200 3600 LO/RF FREQUENCY (MHz)
10 3800
5527 G15
450MHz Conversion Gain, IIP3 and NF vs LO Power
24 22 20 18 SSB NF IIP3 HIGH SIDE LO IF = 140MHz -40C 25C 85C -20 -30
LO Leakage vs LO Frequency
TA = 25C PLO = 0dBm LO-IF (450MHz APP) -40 -50 LO-RF (450MHz APP) -60 -70 -80 400 LO-IF (900MHz APP) LO-RF (900MHz APP)
GC
-6
-4
-2 0 2 LO INPUT POWER (dBm)
4
6
5527 G19
600 800 1000 LO FREQUENCY (MHz)
1200
5527 G20
5527f
5
LT5527
Low Band (900MHz application with external RF/LO matching) VCC = 5V, EN = High, PRF = -5dBm (-5dBm/tone for 2-tone IIP3 tests, f = 1MHz), PLO = 0dBm, IF output measured at 140MHz, unless otherwise noted. Test circuit shown in Figure 1. Conversion Gain, IIP3 and NF vs RF Frequency (900MHz Low Side Application)
25 23 21 19 17 15 13 11 9 7 5 3 GC 800 850 900 950 1000 1050 5527 G21 RF FREQUENCY (MHz) SSB NF LOW SIDE LO TA = 25C IF = 140MHz 25 IIP3
GC, SSB NF (dB), IIP3 (dBm)
TYPICAL AC PERFOR A CE CHARACTERISTICS
GC, SSB NF (dB), IIP3 (dBm)
17 15 13 11 9 7 5 3 1 -6 -4 GC SSB NF
OUTPUT POWER (dBm)
1 750
Conversion Gain, IIP3 and NF vs RF Frequency (900MHz High Side Application)
25 23 IIP3 19 17 15 13 11 9 7 5 3 GC 800 850 900 950 1000 1050 RF FREQUENCY (MHz) 5527 G24 SSB NF HIGH SIDE LO TA = 25C IF = 140MHz GC, SSB NF (dB), IIP3 (dBm) GC, SSB NF (dB), IIP3 (dBm) 21
19 17 15 13 SSB NF 11 9 7 5 3 1 -6 -4 GC
HIGH SIDE LO IF = 140MHz -40C 25C 85C
RELATIVE SPUR LEVEL (dBc)
1 750
TYPICAL DC PERFOR A CE CHARACTERISTICS
Supply Current vs Supply Voltage
82 81
100
SUPPLY CURRENT (mA)
79 78 76 75 74 73 72 71 4.5
85C 60C 25C 0C -40C
SHUTDOWN CURRENT (A)
80
5 4.75 5.25 SUPPLY VOLTAGE (V)
6
UW
UW
900MHz Conversion Gain, IIP3 and NF vs LO Power (Low Side LO)
23 21 19 IIP3 LOW SIDE LO IF = 140MHz -40C 25C 85C
IFOUT, 2 x 2 and 3 x 3 Spurs vs RF Input Power (Single Tone)
20 TA = 25C 10 LO = 760MHz 0 IF = 140MHz -10 -20 -30 -40 -50 -60 -70 -80 -90 3RF-3LO (RF = 806.67MHz) 2RF-2LO (RF = 830MHz) IFOUT (RF = 900MHz)
-2 0 2 LO INPUT POWER (dBm)
4
6
5527 G22
-100 -18 -15 -12 -9 -6 -3 0 3 6 RF INPUT POWER (dBm)
9
12
5527 G23
900MHz Conversion Gain, IIP3 and NF vs LO Power (High Side LO)
25 23 21 IIP3 -40 -45 -50 -55 -60 -65 -70 -75 -80 -85 -90 -2 0 2 LO INPUT POWER (dBm) 4 6
5527 G25
2 x 2 and 3 x 3 Spurs vs LO Power (Single Tone)
TA = 25C LO = 760MHz IF = 140MHz PRF = -5dBm 2RF-2LO (RF = 830MHz)
3RF-3LO (RF = 806.67MHz)
-6
-4
0 2 -2 LO INPUT POWER (dBm)
4
6
5527 G26
Test circuit shown in Figure 1.
Shutdown Current vs Supply Voltage
10
1
85C 60C -40C 25C 0C 5.5
5527 G17
0.1
5.5
5527 G16
4.5
4.75 5 5.25 SUPPLY VOLTAGE (V)
5527f
LT5527
PI FU CTIO S
NC (Pins 1, 2, 4, 8, 13, 14, 16): Not Connected Internally. These pins should be grounded on the circuit board for improved LO-to-RF and LO-to-IF isolation. RF (Pin 3): Single-Ended Input for the RF Signal. This pin is internally connected to the primary side of the RF input transformer, which has low DC resistance to ground. If the RF source is not DC blocked, then a series blocking capacitor must be used. The RF input is internally matched from 1.7GHz to 3GHz. Operation down to 400MHz or up to 3700MHz is possible with simple external matching. EN (Pin 5): Enable Pin. When the input enable voltage is higher than 3V, the mixer circuits supplied through Pins 6, 7, 10 and 11 are enabled. When the input voltage is less than 0.3V, all circuits are disabled. Typical input current is 50A for EN = 5V and 0A when EN = 0V. The EN pin should not be left floating. Under no conditions should the EN pin voltage exceed VCC + 0.3V, even at start-up. VCC2 (Pin 6): Power Supply Pin for the Bias Circuits. Typical current consumption is 2.8mA. This pin should be externally connected to the VCC1 pin and decoupled with 1000pF and 1F capacitors. VCC1 (Pin 7): Power Supply Pin for the LO Buffer Circuits. Typical current consumption is 23.2mA. This pin should be externally connected to the VCC2 pin and decoupled with 1000pF and 1F capacitors. GND (Pins 9, 12): Ground. These pins are internally connected to the backside ground for improved isolation. They should be connected to the RF ground on the circuit board, although they are not intended to replace the primary grounding through the backside contact of the package. IF-, IF + (Pins 10, 11): Differential Outputs for the IF Signal. An impedance transformation may be required to match the outputs. These pins must be connected to VCC through impedance matching inductors, RF chokes or a transformer center tap. LO (Pin 15): Single-Ended Input for the Local Oscillator Signal. This pin is internally connected to the primary side of the LO transformer, which is internally DC blocked. An external blocking capacitor is not required. The LO input is internally matched from 1.2GHz to 5GHz. Operation down to 380MHz is possible with simple external matching. Exposed Pad (Pin 17): Circuit Ground Return for the Entire IC. This must be soldered to the printed circuit board ground plane.
BLOCK DIAGRA
W
U
U
U
15 LO
REGULATOR VCC1 LINEAR AMPLIFIER LIMITING AMPLIFIERS EXPOSED 17 PAD GND 12 IF+ 11
3
RF DOUBLE-BALANCED MIXER BIAS EN 5 6 VCC2 7 VCC1
IF-
10
GND 9
5525 BD
5527f
7
LT5527
TEST CIRCUITS
LOIN L4 0.018" C4 16 EXTERNAL MATCHING FOR LOW FREQUENCY LO ONLY RFIN ZO 50 L (mm) C5 EXTERNAL MATCHING FOR LOW BAND OR HIGH BAND ONLY 1 2 NC NC NC LT5527 3 4 RF NC EN EN 5 6 7 10 IF - GND VCC2 VCC1 NC 8 VCC 9 L2 LO 15 14 NC 13 NC GND IF 12 L1 C3 3 2 1 5 IFOUT 240MHz 0.062" BIAS 0.018" T1 GND
R = 4.4
RF GND
+ 11
*
*
4
APPLICATION RF 900MHz LO Low Side 450MHz High Side 900MHz High Side 3500MHz Low Side REF DES C1 C2 C3 VALUE 1000pF 1F 2.7pF
LO MATCH L4 6.8nH 3.9nH -- -- SIZE 0402 0603 0402 C4 10pF 5.6pF 2.7pF --
RF MATCH L 4.5mm 1.3mm 1.3mm 4.5mm C5 12pF 3.9pF 3.9pF 0.5pF
C1
C2 GND
5527 F01
PART NUMBER AVX 04025C102JAT AVX 0603ZD105KAT AVX 04025A2R7CAT
REF DES L4, C4, C5 L1, L2 T1
VALUE 82nH 4:1
SIZE 0402 0603
PART NUMBER See Applications Information Toko LLQ1608-A82N M/A-Com ETC4-1-2 (2MHz to 800MHz)
Figure 1. Downmixer Test Schematic--Standard IF Matching (240MHz IF)
LOIN L4 C4 16 EXTERNAL MATCHING FOR LOW FREQUENCY LO ONLY RFIN ZO 50 L (mm) C5 EXTERNAL MATCHING FOR LOW BAND OR HIGH BAND ONLY 1 2 NC NC NC LT5527 3 4 RF NC EN EN 5 6 7 IF - GND VCC2 VCC1 NC 8 VCC C1 C2 GND
5527 F02
15 LO
14 NC
13 NC GND IF 12
DISCRETE IF BALUN
C6 L1 L3 C7 C3 IFOUT 240MHz
+ 11
10 9 L2
REF DES C1, C3 C2 C6, C7
VALUE 1000pF 1F 4.7pF
SIZE 0402 0603 0402
PART NUMBER AVX 04025C102JAT AVX 0603ZD105KAT AVX 04025A4R7CAT
REF DES L4, C4, C5 L1, L2 L3
VALUE 100nH 220nH
SIZE 0402 0603 0603
PART NUMBER See Applications Information Toko LLQ1608-AR10 Toko LLQ1608-AR22
Figure 2. Downmixer Test Schematic--Discrete IF Balun Matching (240MHz IF)
5527f
8
LT5527
APPLICATIO S I FOR ATIO
Introduction
The LT5527 consists of a high linearity double-balanced mixer, RF buffer amplifier, high speed limiting LO buffer amplifier and bias/enable circuits. The RF and LO inputs are both single ended. The IF output is differential. Low side or high side LO injection can be used. Two evaluation circuits are available. The standard evaluation circuit, shown in Figure 1, incorporates transformerbased IF matching and is intended for applications that require the lowest LO-IF leakage levels and the widest IF bandwidth. The second evaluation circuit, shown in Figure 2, replaces the IF transformer with a discrete IF balun for reduced solution cost and size. The discrete IF balun delivers comparable noise figure and linearity, higher conversion gain, but degraded LO-IF leakage and reduced IF bandwidth. RF Input Port The mixer's RF input, shown in Figure 3, consists of an integrated transformer and a high linearity differential amplifier. The primary terminals of the transformer are connected to the RF input pin (Pin 3) and ground. The secondary side of the transformer is internally connected to the amplifier's differential inputs. One terminal of the transformer's primary is internally grounded. If the RF source has DC voltage present, then a coupling capacitor must be used in series with the RF input pin.
RF PORT RETURN LOSS (dB)
RF PORT RETURN LOSS (dB)
The RF input is internally matched from 1.7GHz to 3GHz, requiring no external components over this frequency range. The input return loss, shown in Figure 4a, is typically 10dB at the band edges. The input match at the lower band edge can be optimized with a series 2.7pF capacitor
EXTERNAL MATCHING FOR LOW BAND OR HIGH BAND ONLY RFIN ZO = 50 L = L (mm) 3 C5
RF
Figure 3. RF Input Schematic
U
at Pin 3, which improves the 1.7GHz return loss to greater than 20dB. Likewise, the 2.7GHz match can be improved to greater than 30dB with a series 1.5nH inductor. A series 1.5nH/2.7pF network will simultaneously optimize the lower and upper band edges and expand the RF input bandwidth to 1.1GHz-3.3GHz. Measured RF input return losses for these three cases are also plotted in Figure 4a. Alternatively, the input match can be shifted down, as low as 400MHz or up to 3700MHz, by adding a shunt capacitor (C5) to the RF input. A 450MHz input match is realized with C5 = 12pF, located 4.5mm away from Pin 3 on the evaluation board's 50 input transmission line. A 900MHz input match requires C5 = 3.9pF, located at 1.3mm. A 3500MHz input match is realized with C5 = 0.5pF, located
0 -5 -10 -15 -20 SERIES 2.7pF -25 SERIES 1.5nH -30 0.2 0.7 1.2 1.7 2.2 2.7 3.2 FREQUENCY (GHz) 3.7 4.2 SERIES 1.5nH SERIES 2.7pF NO EXTERNAL MATCHING
5527 F04a
W
UU
(4a) Series Reactance Matching
0 -5 -10 -15 -20 -25 450MHz C5 = 12pF L = 4.5mm 0.7 NO EXTERNAL MATCHING 900MHz C5 = 3.9pF L = 1.3mm 3.5GHz C5 = 0.5pF L = 4.5mm
TO MIXER
-30 0.2
1.2 1.7 2.2 2.7 3.2 RF FREQUENCY (GHz)
3.7
4.2
5527 F04b
5527 F03
(4b) Series Shunt Matching Figure 4. RF Input Return Loss With and Without External Matching
5527f
9
LT5527
APPLICATIO S I FOR ATIO
at 4.5mm. This series transmission line/shunt capacitor matching topology allows the LT5527 to be used for multiple frequency standards without circuit board layout modifications. The series transmission line can also be replaced with a series chip inductor for a more compact layout. Input return loss for these three cases (450MHz, 900MHz and 3500MHz) are plotted in Figure 4b. The input return loss with no external matching is repeated in Figure 4b for comparison. RF input impedance and S11 versus frequency (with no external matching) is listed in Table 1 and referenced to Pin 3. The S11 data can be used with a microwave circuit simulator to design custom matching networks and simulate board-level interfacing to the RF input filter.
Table 1. RF Input Impedance vs Frequency
FREQUENCY (MHz) 50 300 450 600 900 1200 1500 1850 2150 2450 2650 3000 3500 4000 5000 INPUT IMPEDANCE 4.8 + j2.6 9.0 + j11.9 11.9 + j15.3 14.3 + j18.2 19.4 + j23.8 26.1 + j29.8 37.3 + j33.9 57.4 + j29.7 71.3 + j10.1 64.6 - j13.9 53.0 - j21.8 35.0 - j21.2 20.7 - j9.0 14.2 + j6.2 10.4 + j31.9 S11 MAG 0.825 0.708 0.644 0.600 0.529 0.467 0.386 0.275 0.193 0.175 0.209 0.297 0.431 0.564 0.745 ANGLE 173.9 152.5 144.3 137.2 123.2 107.4 89.3 60.6 20.6 -36.8 -70.3 -111.2 -155.8 164.8 113.3
LO PORT RETURN LOSS (dB)
LO Input Port The mixer's LO input, shown in Figure 5, consists of an integrated transformer and high speed limiting differential amplifiers. The amplifiers are designed to precisely drive the mixer for the highest linearity and the lowest noise figure. An internal DC blocking capacitor in series with the transformer's primary eliminates the need for an external blocking capacitor.
10
U
The LO input is internally matched from 1.2GHz to 5GHz, although the maximum useful frequency is limited to 3.5GHz by the internal amplifiers. The input match can be shifted down, as low as 750MHz, with a single shunt capacitor (C4) on Pin 15. One example is plotted in Figure 6 where C4 = 2.7pF produces an 850MHz to 1.2GHz match. LO input matching below 750MHz requires the series inductor (L4)/shunt capacitor (C4) network shown in Figure 5. Two examples are plotted in Figure 6 where L4 = 3.9nH/C4 = 5.6pF produces a 650MHz to 830MHz match and L4 = 6.8nH/C4 = 10pF produces a 540MHz to 640MHz match. The evaluation boards do not include pads for L4, so the circuit trace needs to be cut near Pin 15 to insert L4. A low cost multilayer chip inductor is adequate for L4. The optimum LO drive is -3dBm for LO frequencies above 1.2GHz, although the amplifiers are designed to accommodate several dB of LO input power variation without significant mixer performance variation. Below 1.2GHz,
EXTERNAL MATCHING FOR LOW BAND ONLY LOIN L4 15 C4 TO MIXER LO VBIAS LIMITER VCC2
5527 F05
W
UU
Figure 5. LO Input Schematic
0 -5 -10 -15 -20 -25 -30 0.1 1 LO FREQUENCY (GHz) 5
5527 F06
L4 = 6.8nH C4 = 10pF
L4 = 0nH C4 = 2.7pF
NO EXTERNAL MATCHING L4 = 3.9nH C4 = 5.6pF
Figure 6. LO Input Return Loss
5527f
LT5527
APPLICATIO S I FOR ATIO
0dBm LO drive is recommended for optimum noise figure, although -3dBm will still deliver good conversion gain and linearity. Custom matching networks can be designed using the port impedance data listed in Table 2. This data is referenced to the LO pin with no external matching.
Table 2. LO Input Impedance vs Frequency
FREQUENCY (MHz) 50 300 450 600 900 1200 1500 1850 2150 2450 2650 3000 3500 4000 5000 INPUT IMPEDANCE 30.4 - j355.7 8.7 - j52.2 9.4 - j25.4 11.5 - j8.9 19.7 + j12.8 34.3 + j24.3 49.8 + j21.3 53.8 + j8.9 50.4 + j3.2 45.1 + j0.3 41.1 + j2.4 41.9 + j8.1 49.0 + j12.0 55.4 + j8.6 33.2 + j8.7 S11 MAG 0.977 0.847 0.740 0.635 0.463 0.330 0.209 0.093 0.032 0.052 0.101 0.124 0.120 0.096 0.226 ANGLE -15.9 -86.7 -124.8 -158.7 146.7 106.9 78.5 61.7 80.5 176.5 163.1 129.8 87.9 53.2 146.7
IF Output Port The IF outputs, IF+ and IF-, are internally connected to the collectors of the mixer switching transistors (see Figure 7). Both pins must be biased at the supply voltage, which can be applied through the center tap of a transformer or through matching inductors. Each IF pin draws 26mA of supply current (52mA total). For optimum singleended performance, these differential outputs should be combined externally through an IF transformer or a discrete IF balun circuit. The standard evaluation board (see Figure 1) includes an IF transformer for impedance transformation and differential to single-ended transformation. A second evaluation board (see Figure 2) realizes the same functionality with a discrete IF balun circuit. The IF output impedance can be modeled as 415 in parallel with 2.5pF at low frequencies. An equivalent small-signal model (including bondwire inductance) is shown in Figure 8. Frequency-dependent differential IF
IF+ L1 11 C3 IF- 10 L2 VCC
5527 F07
U
output impedance is listed in Table 3. This data is referenced to the package pins (with no external components) and includes the effects of IC and package parasitics. The IF output can be matched for IF frequencies as low as several kHz or as high as 600MHz.
Table 3. IF Output Impedance vs Frequency
FREQUENCY (MHz) 1 10 70 140 240 300 380 450 500 DIFFERENTIAL OUTPUT IMPEDANCE (RIF || XIF) 415||-j64k 415||-j6.4k 415||-j909 413||-j453 407||-j264 403||-j211 395||-j165 387||-j138 381||-j124
W
UU
The following three methods of differential to singleended IF matching will be described: * Direct 8:1 transformer * Lowpass matching + 4:1 transformer * Discrete IF balun
4:1
IFOUT 50
VCC
Figure 7. IF Output with External Matching
0.7nH RS 415
IF+
11
2.5pF IF- 0.7nH
5527 F08
10
Figure 8. IF Output Small-Signal Model
5527f
11
LT5527
APPLICATIO S I FOR ATIO
Direct 8:1 IF Transformer Matching
For IF frequencies below 100MHz, the simplest IF matching technique is an 8:1 transformer connected across the IF pins. The transformer will perform impedance transformation and provide a single-ended 50 output. No other matching is required. Measured performance using this technique is shown in Figure 9. This matching is easily implemented on the standard evaluation board by shorting across the pads for L1 and L2 and replacing the 4:1 transformer with an 8:1 (C3 not installed).
25 23 IIP3 RF = 900MHz HIGH SIDE LO AT 0dBm VCC = 5V DC TA = 25C C4 = 2.7pF, C5 = 3.9pF
GC (dB), IIP3 (dBm), SSB NF (dB)
21 19 17 15 13 11 9 5 3 1 10
SSB NF
GC
IF PORT RETURN LOSS (dB)
7
20
30 40 50 60 70 80 90 100 IF OUTPUT FREQUENCY (MHz)
5527 F09
Figure 9. Typical Conversion Gain, IIP3 and SSB NF Using an 8:1 IF Transformer
Lowpass + 4:1 IF Transformer Matching The lowest LO-IF leakage and wide IF bandwidth are realized by using the simple, three element lowpass matching network shown in Figure 7. Matching elements C3, L1 and L2, in conjunction with the internal 2.5pF capacitance, form a 400 to 200 lowpass matching network which is tuned to the desired IF frequency. The 4:1 transformer then transforms the 200 differential output to a 50 single-ended output. This matching network is most suitable for IF frequencies above 40MHz or so. Below 40MHz, the value of the series inductors (L1 and L2) becomes unreasonably high, and could cause stability problems, depending on the inductor value and parasitics. Therefore, the 8:1 transformer technique is recommended for low IF frequencies. Suggested lowpass matching element values for several IF frequencies are listed in Table 4. High-Q wire-wound
12
U
chip inductors (L1 and L2) improve the mixer's conversion gain by a few tenths of a dB, but have little effect on linearity. Measured output return losses for each case are plotted in Figure 10 for the simple 8:1 transformer method and for the lowpass/4:1 transformer method.
Table 4. IF Matching Element Values IF FREQUENCY (MHz) 1 to 100 140 190 240 380 450
0 -5 -10 -15 -20 -25 1 -30 0 50 100 150 200 250 300 350 400 450 500 IF FREQUENCY (MHz)
5527 F10
W
UU
PLOT 1 2 3 4 5 6
L1, L2 (nH) Short 120 110 82 56 43
C3 (pF) -- -- 2.7 2.7 2.2 2.2
IF TRANSFORMER TC8-1 (8:1) ETC4-1-2 (4:1) ETC4-1-2 (4:1) ETC4-1-2 (4:1) ETC4-1-2 (4:1) ETC4-1-2 (4:1)
2 3
4
5 6
Figure 10. IF Output Return Losses with Lowpass/Transformer Matching
Discrete IF Balun Matching For many applications, it is possible to replace the IF transformer with the discrete IF balun shown in Figure 2. The values of L1, L2, C6 and C7 are calculated to realize a 180 degree phase shift at the desired IF frequency and provide a 50 single-ended output, using the equations listed below. Inductor L3 is calculated to cancel the internal 2.5pF capacitance. L3 also supplies bias voltage to the IF+ pin. Low cost multilayer chip inductors are adequate for L1 and L2. A high Q wire-wound chip inductor is recommended for L3 to maximize conversion gain and minimize DC voltage drop to the IF+ pin. C3 is a DC blocking capacitor.
5527f
LT5527
APPLICATIO S I FOR ATIO
L1, L2 = C6,C7 = XIF L3 = IF RIF * ROUT IF 1 IF * RIF * ROUT
IF PORT RETURN LOSS (dB)
GC (dB), IIP3 (dBm)
Compared to the lowpass/4:1 transformer matching technique, this network delivers approximately 0.8dB higher conversion gain (since the IF transformer loss is eliminated) and comparable noise figure and IIP3. At a 15% offset from the IF center frequency, conversion gain and noise figure degrade about 1dB. Beyond 15%, conversion gain decreases gradually but noise figure increases rapidly. IIP3 is less sensitive to bandwidth. Other than IF bandwidth, the most significant difference is LO-IF leakage, which degrades to approximately - 38dBm compared to the superior performance realized with the lowpass/4:1 transformer matching. Discrete IF balun element values for four common IF frequencies are listed in Table 5. The corresponding measured IF output return losses are shown in Figure 11. The values listed in Table 5 differ from the calculated values slightly due to circuit board and component parasitics. Typical conversion gain, IIP3 and LO-IF leakage, versus RF input frequency, for all four IF frequency examples is shown in Figure 12. Typical conversion gain, IIP3 and noise figure versus IF output frequency for the same circuits are shown in Figure 13.
Table 5. Discrete IF Balun Element Values (ROUT = 50) IF FREQUENCY (MHz) 190 240 380 450 L1, L2 (nH) 120 100 56 47 C6, C7 (pF) 6.8 4.7 3 2.7 L3 (nH) 220 220 68 47
For fully differential IF architectures, the IF transformer can be eliminated. An example is shown in Figure 14, where the mixer's IF output is matched directly into a SAW filter. Supply voltage to the mixer's IF pins is applied
GC, SSB NF (dB), IIP3 (dBm)
U
0 -5 -10 -15 190MHz -20 240MHz -25 -30 50 100 150 200 250 300 350 400 450 500 550 IF FREQUENCY (MHz)
5527 F11
W
UU
380MHz 450MHz
Figure 11. IF Output Return Losses with Discrete Balun Matching
26 24 22 20 18 16 14 12 10 8 6 4 GC 1900 2300 2500 2100 RF INPUT FREQUENCY (MHz) LO-IF -40 -50 -60 2700
5527 F12
0 IIP3 190IF 240IF 380IF 450IF -10
LO-IF LEAKAGE (dBm)
LOW SIDE LO (-3dBm) -20 TA = 25C -30
2 1700
Figure 12. Conversion Gain, IIP3 and LO-IF Leakage vs RF Input Frequency Using Discrete IF Balun Matching
26 24 22 IIP3 20 LOW SIDE LO (-3dBm) TA = 25C 18 16 14 12 SSB NF 190IF 10 240IF 8 380IF 6 450IF GC 4 2 0 150 200 250 300 350 400 450 500 550 IF OUTPUT FREQUENCY (MHz)
5527 F13
Figure 13. Conversion Gain, IIP3 and SSB NF vs IF Output Frequency Using Discrete IF Balun Matching
5527f
13
LT5527
APPLICATIO S I FOR ATIO
through matching inductors in a band-pass IF matching network. The values of L1, L2 and C3 are calculated to resonate at the desired IF frequency with a quality factor that satisfies the required IF bandwidth. The L and C values are then adjusted to account for the mixer's internal 2.5pF capacitance and the SAW filter's input capacitance. In this case, the differential IF output impedance is 400 since the bandpass network does not transform the impedance. Additional matching elements may be required if the SAW filter's input impedance is less than or greater than 400. Contact the factory for application assistance.
Standard Evaluation Board Layout
14
U
IF
+
W
UU
L1 C3
SAW FILTER
IF AMP
IF -
L2
5527 F14
SUPPLY DECOUPLING
VCC
Figure 14. Bandpass IF Matching for Differential IF Architectures
Discrete IF Evaluation Board Layout
5527f
LT5527
PACKAGE DESCRIPTIO
4.35 0.05 2.15 0.05 2.90 0.05 (4 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS BOTTOM VIEW--EXPOSED PAD 4.00 0.10 (4 SIDES) PIN 1 TOP MARK (NOTE 6) 2.15 0.10 (4-SIDES) 0.75 0.05 R = 0.115 TYP PIN 1 NOTCH R = 0.20 TYP OR 0.25 x 45 CHAMFER
NOTE: 1. DRAWING CONFORMS TO JEDEC PACKAGE OUTLINE MO-220 VARIATION (WGGC) 2. DRAWING NOT TO SCALE 3. ALL DIMENSIONS ARE IN MILLIMETERS 4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE 5. EXPOSED PAD SHALL BE SOLDER PLATED 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE
Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no representation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
U
UF Package 16-Lead Plastic QFN (4mm x 4mm)
(Reference LTC DWG # 05-08-1692)
0.72 0.05 PACKAGE OUTLINE 0.30 0.05 0.65 BSC 15 16 0.55 0.20 1 2
(UF) QFN 09-04
0.200 REF 0.00 - 0.05
0.30 0.05 0.65 BSC
5527f
15
LT5527
RELATED PARTS
PART NUMBER DESCRIPTION Infrastructure LT5511 LT5512 LT5514 LT5515 LT5516 LT5517 LT5519 LT5520 LT5521 LT5522 LT5524 LT5525 LT5526 LT5528 High Linearity Upconverting Mixer DC-3GHz High Signal Level Downconverting Mixer Ultralow Distortion, IF Amplifier/ADC Driver with Digitally Controlled Gain 1.5GHz to 2.5GHz Direct Conversion Quadrature Demodulator 0.8GHz to 1.5GHz Direct Conversion Quadrature Demodulator 40MHz to 900MHz Quadrature Demodulator RF Output to 3GHz, 17dBm IIP3, Integrated LO Buffer DC to 3GHz, 17dBm IIP3, Integrated LO Buffer 850MHz Bandwidth, 47dBm OIP3 at 100MHz, 10.5dB to 33dB Gain Control Range 20dBm IIP3, Integrated LO Quadrature Generator 21.5dBm IIP3, Integrated LO Quadrature Generator 21dBm IIP3, Integrated LO Quadrature Generator COMMENTS
0.7GHz to 1.4GHz High Linearity Upconverting Mixer 17.1dBm IIP3 at 1GHz, Integrated RF Output Transformer with 50 Matching, Single-Ended LO and RF Ports Operation 1.3GHz to 2.3GHz High Linearity Upconverting Mixer 15.9dBm IIP3 at 1.9GHz, Integrated RF Output Transformer with 50 Matching, Single-Ended LO and RF Ports Operation 10MHz to 3700MHz High Linearity Upconverting Mixer 400MHz to 2.7GHz High Signal Level Downconverting Mixer 24.2dBm IIP3 at 1.95GHz, NF = 12.5dB, 3.15V to 5.25V Supply, Single-Ended LO Port Operation 4.5V to 5.25V Supply, 25dBm IIP3 at 900MHz, NF = 12.5dB, 50 Single-Ended RF and LO Ports
Low Power, Low Distortion ADC Driver with Digitally 450MHz Bandwidth, 40dBm OIP3, 4.5dB to 27dB Gain Control Programmable Gain High Linearity, Low Power Downconverting Mixer High Linearity, Low Power Downconverting Mixer 1.5GHz to 2.4GHz High Linearity Direct I/Q Modulator 800MHz to 2.7GHz RF Measuring Receiver RF Power Detectors with >40dB Dynamic Range 100kHz to 1000MHz RF Power Detector 300MHz to 7GHz RF Power Detector 300MHz to 3GHz RF Power Detector 300MHz to 7GHz Precision RF Power Detector 300MHz to 7GHz Precision RF Power Detector 300MHz to 7GHz Precision RF Power Detector 50MHz to 3GHz RF Power Detector with 60dB Dynamic Range Precision 600MHz to 7GHz RF Detector with Fast Compatator Output 500MHz Quadrature Demodulator with VGA and 17MHz Baseband Bandwidth 12-Bit, 80Msps 14-Bit, 80Msps Single-Ended 50 RF and LO Ports, 17.6dBm IIP3 at 1900MHz, ICC = 28mA 3V to 5.3V Supply, 16.5dBm IIP3, 100kHz to 2GHz RF, NF = 11dB, ICC = 28mA, -65dBm LO-RF Leakage 21.8dBm OIP3 at 2GHz, -159dBm/Hz Noise Floor, 50 Interface at all Ports
RF Power Detectors LT5504 LTC 5505 LTC5507 LTC5508 LTC5509 LTC5530 LTC5531 LTC5532 LT5534 LTC5536
(R)
80dB Dynamic Range, Temperature Compensated, 2.7V to 5.25V Supply 300MHz to 3GHz, Temperature Compensated, 2.7V to 6V Supply 100kHz to 1GHz, Temperature Compensated, 2.7V to 6V Supply 44dB Dynamic Range, Temperature Compensated, SC70 Package 36dB Dynamic Range, Low Power Consumption, SC70 Package Precision VOUT Offset Control, Shutdown, Adjustable Gain Precision VOUT Offset Control, Shutdown, Adjustable Offset Precision VOUT Offset Control, Adjustable Gain and Offset 1dB Output Variation over Temperature, 38ns Response Time 25ns Response Time, Comparator Reference Input, Latch Enable Input, -26dBm to +12dBm Input Range 17MHz Baseband Bandwidth, 40MHz to 500MHz IF, 1.8V to 5.25V Supply, -7dB to 56dB Linear Power Gain 500MHz BW S/H, 71.8dB SNR 500MHz BW S/H, 75.5dB SNR
5527f
Low Voltage RF Building Block LT5546
Wide Bandwidth ADCs LTC1749 LTC1750
16
Linear Technology Corporation
1630 McCarthy Blvd., Milpitas, CA 95035-7417
(408) 432-1900 FAX: (408) 434-0507
LT/TP 0305 500 * PRINTED IN THE USA
www.linear.com
(c) LINEAR TECHNOLOGY CORPORATION 2005

▲Up To Search▲

Price & Availability of LT5527

	To Download LT5527 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .